IC插座

MILL-MAX IC插座：BGA插座适配器的特点

• BGA adapter/socket systems are a reliable way to make BGAs pluggable. They may also be used as a high density board-to-board interconnect
• The BGA device for a 0,8mm or 1mm grid is soldered to a 9929 adapter (or a 7929 adapter is soldered to a PCB), then either one can be plugged into a 9942 (0.8mm grid) or 9928 (1mm grid) surface mount socket MILL-MAX IC插座：BGA插座适配器
• The BGA device for a .050” grid is soldered to a 8737/4048 adapter (or a 4098/4054 adapter is soldered to  a PCB), then either one can be plugged into a 8214 surface mount socket MILL-MAX IC插座：BGA插座适配器
• Both socket and adapter have the same footprint as the BGA device
• Insertion force is .4N per pin for standard pins 7929/9929, 8737/4098. Tapered EZ-IN pins 4048/4054 reduce insertion force to only .08N, and are recommended for pin counts greater than 500
• Insulator material is FR-4 epoxy having a TCE to match the BGA device and circuit board
• For Electrical, Mechanical and Environmental Data, see page 141 for details MILL-MAX IC插座：BGA插座适配器

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